The previous article described: Thermal shrinkage tube insulated cable shielding layer "analysis", which analyzed the shielding layer in the production process will produce a variety of defects, and then for you to explain in order to eliminate the heat shrinkable tube shielding layer of various defects, so that the interface has a high degree of smoothness, must do the following points:

(1) The use of semiconductor mixtures with good extrusion;

(2) Good semiconductor material mixing process, carbon black must be evenly dispersed, moist carbon black or other mixtures are strictly prohibited to use;

(3) internal and external semiconductor materials and insulation materials at the same time extrusion. The current mass production of XLPE (and other polymers) insulation is generally based on a multilayer extrusion process (1 +2 extrusion, 2+2 extrusion or 3 layer extrusion), which solves the problem of close a and other defects on the interface.

Sometimes the outer semiconductor is wrapped around the insulation by a semiconductor band, at which point a layer of graphite floating suspension is applied to the insulating layer to ensure good contact with the semiconductor.

消除热缩管材料蔽层缺陷的方法

上一篇讲述了： 热缩管绝缘电缆屏蔽层【分析】，其中分析了屏蔽层在生产过程中会产生各种缺陷，接下为你来讲解为了消除热缩管屏蔽层的各种缺陷，使界面有高度光滑性，必须做到如下几点:

(1)采用有良好挤出性的半导体混合料;

(2)良好的半导体料混合工艺，碳黑必须均匀分散，潮湿的碳黑或其他混合料都严禁使用;

(3)内外半导体料与绝缘料同时挤出。当前XLPE(及其他聚合物)绝缘的大量生产一般都采用多层挤出工艺((1 +2挤出、2+2挤出或3层挤出)，基上解决了界面上的密切a合和其他缺陷问题。

有时外半导体是由半导体带绕包在绝缘上的，此时绝缘层上要涂抹一层石墨浮悬浆，以保证与半导体带有良好的接触。